Main Specifications
Product Description: EDGE NextGen - solid state drive - 1 TB - PCI Express 3.0 x4 (NVMe) - TAA Compliant
Type: Solid state drive - internal
Capacity: 1 TB
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: M.2 2280 (double-sided)
Interface: PCI Express 3.0 x4 (NVMe)
Features: Temperature sensor, TRIM support, StaticDataRefresh Technology, Wear Leveling Support, Data Path Protection, 3D NAND Technology, SLC cache, Advanced LDPC ECC Technology, NVM Express (NVMe) 1.3, Silicon Motion SM2262 controller, L1.2 low-power mode, S.M.A.R.T.
Dimensions (WxDxH): 0.9 in x 3.1 in x 0.1 in
Weight: 0.25 oz
TAA Compliant: Yes
Manufacturer Warranty: 3-year warranty
General
Device Type: Solid state drive - internal
Capacity: 1 TB
NAND Flash Memory Type: 3D triple-level cell (TLC)
Form Factor: M.2 2280 (double-sided)
Interface: PCI Express 3.0 x4 (NVMe)
Features: Temperature sensor, TRIM support, StaticDataRefresh Technology, Wear Leveling Support, Data Path Protection, 3D NAND Technology, SLC cache, Advanced LDPC ECC Technology, NVM Express (NVMe) 1.3, Silicon Motion SM2262 controller, L1.2 low-power mode, S.M.A.R.T.
Width: 0.9 in
Depth: 3.1 in
Height: 0.1 in
Weight: 0.25 oz
Performance
Internal Data Rate: 2710 MBps (read) / 1775 MBps (write)
Maximum 4KB Random Write: 280000 IOPS
Maximum 4KB Random Read: 283000 IOPS
Reliability
MTBF: 1,500,000 hours
Expansion & Connectivity
Interfaces: 1 x PCI Express 3.0 x4 - M.2 Card
Compatible Bay: M.2 2280 (double-sided)
Power
Power Consumption: 5.7 Watt (active)
0.3 Watt (idle)
Miscellaneous
Compliant Standards: FCC, RoHS, WWN
TAA Compliant: Yes
Manufacturer Warranty
Service & Support: Limited warranty - 3 years
Environmental Parameters
Min Operating Temperature: 32 °F
Max Operating Temperature: 158 °F
Min Storage Temperature: -40 °F
Max Storage Temperature: 185 °F